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TNPU e3
Vishay Draloric
High Precision Thin Film Chip Resistors 0.05 %; 5 ppm/K
FEATURES
* Low temperature coefficient and tight tolerances ( 0.05 %; 5 ppm/K) * Superior moisture resistivity 0.25 % (85 C; 56 days; 85 % RH) * Waste gas resistant * AEC-Q200 qualified * Compliant to RoHS directive 2002/95/EC * Find out more about Vishay's Automotive Grade Product requirements at: www.vishay.com/applications TNPU e3 High Precision Thin Film Flat Chip Resistors combine the proven reliability of TNPW e3 products with a most advanced level of precision and stability. This unique combination makes the product perfectly suited for all applications with outstanding requirements towards size, reliable precision and stability.
APPLICATIONS
* * * * * * Industrial equipment Telecommunication Medical equipment Instrumentation Test and measuring equipment Automotive
STANDARD ELECTRICAL SPECIFICATIONS
TNPU0603 e3 Metric size Resistance range Resistance tolerance Temperature coefficent Climatic category (LCT/UCT/days) Rated dissipation, P70
(1)
TNPU0805 e3 RR 2012M 100 to 332 k 0.1 %; 0.05 % 10 ppm/K; 5 ppm/K
TNPU1206 e3 RR 3216M 100 to 511 k
RR 1608M 100 to 100 k
55/125/56 0.1 W 75 V 125 C 550 K/W
55/125/56 0.125 W 150 V 125 C 440 K/W
55/125/56 0.25 W 200 V 125 C 220 K/W
Operating voltage, Umax. AC/DC Maximum permissible film temperature Thermal resistance (2) Max. resistance change at P70; |R/R| 1000 h 8000 h 225 000 h Insulation voltage: Uins 1 min Continuous FITobserved Weight/1000 pieces Notes
0.05 % 0.10 % 0.30 %
0.05 % 0.10 % 0.30 %
0.05 % 0.10 % 0.30 %
100 V 75 V 0.1 x 10-9/h 2g
200 V 75 V 0.1 x 10-9/h 5.5 g
300 V 75 V 0.1 x 10-9/h 10 g
voltage P x R . The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. (2) Measuring conditions in accordance with EN 140401-801.
(1) Rated
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Document Number: 28779 Revision: 12-Aug-10
TNPU e3
High Precision Thin Film Chip Resistors 0.05 %; 5 ppm/K
DIMENSIONS
SIZE INCH METRIC 0603 0805 1206 1608 2012 3216 L DIMENSIONS in millimeters W H T1 T2
Vishay Draloric
1.6 0.10 0.85 0.10 0.45 0.10 2.0 0.15 1.25 0.15 0.45 0.10 3.2 0.15 1.6 0.15 0.55 0.10
0.3 0.20 0.4 0.20 0.5 0.25
SOLDER PAD DIMENSIONS in millimeters SIZE INCH METRIC 0603 0805 1206 1608 2012 3216 REFLOW SOLDERING a 0.5 0.7 0.9 b 0.9 1.3 1.7 l 1.0 1.2 2.0 WAVE SOLDERING a 0.9 0.9 1.1 b 0.9 1.3 1.7 l 1.0 1.3 2.3
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE TNPU0603 e3 TCR 10 ppm/K 5 ppm/K 10 ppm/K TNPU0805 e3 5 ppm/K 10 ppm/K TNPU1206 e3 5 ppm/K 0.1 % 0.05 % 0.05 % 0.1 % 0.05 % 0.05 % 0.1 % 0.05 % 100 to 511 k 100 to 332 k E24 to E192 TOLERANCE 0.05 % 100 to 100 k RESISTANCE VALUE E-SERIES
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: TNPU12061K32AZEA00
T
MODEL
N
P
U
VALUE
1
2
0
6
1
K
3
TCR
2
A
Z
E
A
0
0
SPECIAL
TOLERANCE B = 0.1 % A = 0.05 %
PACKAGING (1) EA EN
TNPU0603 TNPU0805 TNPU1206
R = Decimal K = Thousand M = Million (4 digits)
Y = 10 ppm/K Z = 5 ppm/K
Up to 2 digits 00 = Standard
Product Description: TNPU1206 1K32 0.05 % T-16 ET1 e3 TNPU1206 MODEL TNPU0603 TNPU0805 TNPU1206 1K32 RESISTANCE VALUE Examples: 1K32 = 1320 0.05 % TOLERANCE 0.05 % 0.1 % T-16 TCR T-13 = 10 ppm/K T-16 = 5 ppm/K ET1 PACKAGING (1) ET1 E52 e3 LEAD (Pb)-FREE e3 = Pure tin termination finish
Notes * Products can be ordered using either the PRODUCT DESCRIPTION or the PART NUMBER. (1) Please refer to PACKAGING table.
Document Number: 28779 Revision: 12-Aug-10
For technical questions, contact: thinfilmchip@vishay.com
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TNPU e3
Vishay Draloric
High Precision Thin Film Chip Resistors 0.05 %; 5 ppm/K
PACKAGING
MODEL TAPE WIDTH [mm] PITCH [mm] REEL DIAMETER [mm/inch] PIECES PER REEL 1000 8 4 180/7 5000 ET1 EA PACKAGING CODE FOR PRODUCT DESCRIPTION E52 PACKAGING CODE FOR PART NUMBER EN Paper TYPE OF CARRIER TAPE
TNPU0603 e3 TNPU0805 e3 TNPU1206 e3
DESCRIPTION
Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a high grade AI2O3 ceramic substrate and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. A further conditioning is applied in order to stabilize the trimming result. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 (3).
ASSEMBLY
The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapour phase as shown in IEC 61760-1. The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. The immunity of the plating against tin whisker growth has been proven under extensive testing. All products comply with the GADSL (1) and the CEFIC-EECA-EICTA (2) list of legal restrictions on hazardous substances. This includes full compliance with the following directives: * 2000/53/EC End of Vehicle life Directive (ELV) and Annex II (ELV II) * 2002/95/EC Restriction of the Substances Directive (RoHS) use of Hazardous
* 2002/96/EC Waste Electrical and Electronic Equipment Directive (WEEE) Solderability is specified for 2 years after production or re-qualification. The permitted storage time is 20 years.
Notes
(1) (2)
Global Automotive Declarable Substance List, see www.gadsl.org. CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade organisation representing the information and communications technology and consumer electronics), see www.eicta.org issue environment policy chemicals chemicals for electronics. The quoted IEC standards are also released as EN standards with the same number and identical contents.
(3)
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Document Number: 28779 Revision: 12-Aug-10
TNPU e3
High Precision Thin Film Chip Resistors 0.05 %; 5 ppm/K
Vishay Draloric
Non-Linearity A3 in dB
110 100 90 80 70 60 40 100
TNPU1206 e3 TNPU0805 e3 TNPU0603 e3
Current Noise in V/V
1
TNPU0805 e3 TNPU0603 e3
0.1
TNPU1206 e3
1K
10K
Non-Linearity
100K 1M Resistance Value in
0.01 100
1K
10K
Current Noise
100K 1M Resistance Value in
Rated Power in %
120 100
80
60
40 20 0 - 55
- 25
0
25
50
70
75
100
125
150 175
Derating
Ambient Temperature in C
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following specifications: EN 60115-1, generic specification (includes tests) EN 140 400, sectional specification (includes schedule for qualification approval) EN 140 401-801, detail specification (includes schedule for conformance inspection) The following table contains only the most important tests. For the full test schedule refer to the documents listed above. The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5202. The tests are carried out in accordance with IEC 60068 and under standard atmospheric conditions in accordance with IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated temperature range: Lower category temperature, upper category temperature; damp heat, long term, 56 days) is valid. Unless otherwise specified
Document Number: 28779 Revision: 12-Aug-10
the following values apply: Temperature: 15 C to 35 C Relative humidity: 45 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). The components are mounted for testing on boards in accordance with EN 60115-1, 4.31 unless otherwise specified. The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140 401-801. However, some additional tests and a number of improvements against those minimum requirements have been included.
For technical questions, contact: thinfilmchip@vishay.com
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TNPU e3
Vishay Draloric
High Precision Thin Film Chip Resistors 0.05 %; 5 ppm/K
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE Stability for product types: TNPU0603 e3 TNPU0805 e3 TNPU1206 e3 4.5 4.8.4.2 Resistance Temperature coefficient At (20/- 55/20) C and (20/125/20) C U = P 70 x R or U = Umax.; whichever is the less severe; 4.25.1 Endurance at 70 C 1.5 h "ON"; 0.5 h "OFF"; 70 C; 1000 h 70 C; 8000 h Endurance at upper category temperature Damp heat, steady state Climatic sequence: 2 (Ba) 30 (Db) 1 (Aa) 13 (M) Dry heat Damp heat, cyclic Cold Low air pressure Damp heat, cyclic UCT; 16 h 55 C; 24 h; > 90 % RH; 1 cycle LCT; 2 h (0.1 % R + 0.02 ) 8.5 kPa; 2 h; 25 10 C 55 C; 5 days; > 95 to 100 % RH; 5 cycles U= 4.23.7 D.c. load P 70 x R Umax.; 1 min LCT = - 55 C UCT = 125 C - 55 C; 2 h 30 min at LCT and 30 min at UCT; LCT = - 55 C; UCT = 125 C; 1000 cycles U = 2.5 x P 70 x R or U = 2 x Umax.; whichever is the less severe; 5 s (0.05 % R + 0.01 ) (0.05 % R + 0.01 ) (0.1 % R + 0.02 ) 0.1 %; 0.05 % 10 ppm/K; 5 ppm/K REQUIREMENTS PERMISSIBLE CHANGE
4.25.3
-
125 C; 1000 h
(0.05 % R + 0.01 )
4.24
78 (Cab)
(40 2) C; 56 days; (93 3) % RH
(0.1 % R + 0.01 )
4.23 4.23.2 4.23.3 4.23.4 4.23.5
4.23.6
30 (Db)
-
1 (Aa)
Cold Rapid change of temperature
4.19
14 (Na)
(0.1 % R + 0.01 )
4.13
-
Short time overload
(0.05 % R + 0.01 )
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For technical questions, contact: thinfilmchip@vishay.com
Document Number: 28779 Revision: 12-Aug-10
TNPU e3
High Precision Thin Film Chip Resistors 0.05 %; 5 ppm/K
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE Stability for product types: TNPU0603 e3 TNPU0805 e3 TNPU1206 e3 Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude 1.5 mm or 200 m/s2; 6 h Solder bath method; SnPb40; non-activated flux (215 3) C; (3 0.3) s 4.17.2 58 (Td) Solderability Solder bath method; SnAg3Cu0,5 or SnAg3,5; non-activated flux (235 3) C; (2 0.2) s Solder bath method; (260 5) C; (10 1) s Isopropyl alcohol + 50 C; method 2 RR 1005M and RR 1608M; 9N No visible damage RR 2012M and RR 3216M; 45 N 4.33 4.7 4.35 21 (Ue1) Substrate bending Voltage proof Flammability Depth 2 mm, 3 times URMS = Uins; 60 5 s IEC 60695-11-5, needle flame test; 10 s (85 5) C; 56 days (85 5) % RH (0.05 % R + 0.01 ) no visible damage, no open circuit in bent position No flashover or breakdown No burning after 30 s (0.25 R + 0.05 ) Good tinning ( 95 % covered); no visible damage REQUIREMENTS PERMISSIBLE CHANGE
Vishay Draloric
4.22
6 (Fc)
Vibration
(0.05 % R + 0.01 ) no visible damage
4.18.2
58 (Td)
Resistance to soldering heat Component solvent resistance Shear (adhesion)
(0.02 % R + 0.01 )
4.29
45 (XA)
No visible damage
4.32
21 (Ue3)
-
Damp heat
Document Number: 28779 Revision: 12-Aug-10
For technical questions, contact: thinfilmchip@vishay.com
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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